View UPD166005GR-E2-AZ_3874329.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. mos integrated circuit pd166005 single n-channel hi gh side intellig ent power device data sheet document no. s19284ej1v0ds00 (1st edition) date published july 2008 ns printed in japan 2008 description the pd166005 is n-channel high side driver with charge pu mp, diagnostic function, embedded protection functions. when the device is over temperature or over current is gene rated in output mos, the protection function operates while the built-in diagnosis output sign al is output. in addition, the built-in diagnos is signal is output when open status of the output pin is detected. features ? high temperature operation (t ch = 175 c max.) ? built-in charge pump circuit ? low on-state resistance r ds(on) = 100 m max. (v in = v ih , i o = 1.5 a, t ch = 25 c) ? built-in protection circuit - current limitation - over temperature protection ? built-in open load detection circuit ? built-in diagnosis output circuit ? package: power sop 8 ordering information part number lead plating packing package pd166005gr-e1-az note sn-bi tape 2500 p/reel power sop 8 pd166005gr-e2-az note sn-bi tape 2500 p/reel power sop 8 note pb-free (this product does not co ntain pb in the external electrode.) quality grade part number quality grade pd166005gr-e1-az note special pd166005gr-e2-az note special please refer to "quality grades on nec semiconductor devices" (document no. c11531e) published by nec corporation to know the specification of quality grade on the devices and its recommended applications. application ? switching of types of 14 v loads such as l load, resistance and capacity.
data sheet s19284ej1v0ds 2 pd166005 block diagram pin configuration ? power sop 8 pin functions pin no. pin name function 1 in input pin 2 diag diag output pin 3 gnd ground pin 4 out high side output pin 5 vcc power supply pin 6 vcc power supply pin 7 vcc power supply pin 8 vcc power supply pin 1 2 3 4 8 7 6 5 in diag gnd out vcc vcc vcc vcc top view charge pump power supply voltage sense diagnosis (nch open drain) out internal power supply load v o v out v diag 1 4 i o rdiag 5 v output voltage sense temperature sensor current detector vcc i diag i cc i in ropen 3 5, 6, 7, 8 v bat v in in 2 diag gnd i ohl v cc control logic
data sheet s19284ej1v0ds 3 pd166005 absolute maximum ratings (t a = 25 c, unless otherwise specified) parameter symbol condition rating unit power supply voltage v cc 1 ? 0.3 to +35 v v cc 2 r s = 1 , = 250 ms 60 v input voltage v in ? 0.5 to +7.0 v input current i in 10 ma output current i oa 2 a output negative voltage v oa v cc ? 60 v power dissipation p d t a = 25 c note 1.0 w operation temperature topt ? 40 to +125 c storage temperature tstg ? 55 to +175 c diag output voltage v diag 7.0 v diag output current i diag 10 ma note when mounted on a glass substrate epoxy (where fr-4 is 10 cm x 10 cm, dimension of copper foil is 15% and thickness of copper foil is 35 m) caution product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameters. that is, the absolute maximum rating s are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. the ratings and conditions indicated for dc charact eristics and ac characteris tics represent the quality assurance range during normal operation. recommended operationg conditions (t a = ? 40 c to +125 c, unless otherwise specified) parameter symbol conditions min. typ. max. unit power supply voltage v cc v ih = 3 v, v o = v cc ? 0.4 v (rl = 9.3 ), v il = 1 v, v o = 0.2 v (rl = 9.3 ), v diag = 0.5 v (i diag = 0.6 ma) 4.5 16 v input voltage v ih v cc = 4.5 to 16 v 3 7.0 v v il 0 1.0 v output current i oa v cc = 8 to 16 v 0 1.5 a diag output voltage v diag 0 7.0 v diag output current i diag 0 0.6 ma
data sheet s19284ej1v0ds 4 pd166005 electrical specifications (v cc = 8 to 16 v, t ch = ? 40 to +175 c, unless otherwise specified) parameter symbol conditions min. typ. max. unit input voltage v ih v cc = 4.5 to 16 v 3 7.0 v v il 0 1.0 v input current i ih v in = 5.5 v 30 400 a i il v in = 0 v ? 10 a standby current note1 i cch v in = v ih 4 ma i ccl v in = v il 0.2 ma output leakage current i oh1 v in = v il , v o = v cc 2000 a i oh2 v in = v il , v o = 4 v 400 a i ol v in = v il , v o = 0 v ? 240 a diag output low level voltage v diag v cc = 4.5 to 16 v, i diag = 0.6 ma 0.5 v diag output leakage current i diag v diag = 7.0 v 10 a open load detection v oih v in = 0 v, v diag changing point (l h) 4 v load connection detection v oil v in = 0 v, v diag changing point (h l) 1.45 v r ds(on) v in = v ih , i o = 1.5 a t ch = 25 c 80 100 m drain to source on-state resistance t ch = 150 c 150 180 m over current detection note2 i s 2 (10) a over temperature detection note2 tth (175) c turn on delay time t d(on) rl = 9.3 , v cc = 14 v 5 50 s turn off delay time t d(off) 50 200 s rise time t on 30 200 s fall time t off 20 200 s diag output delay time t dpd rl = 13 , v cc = 14 v 200 s negative output voltage ? v o i o = ? 60 ma v cc ? 50 v output oscillation cycle at over current condition t s over current 14 ms output on duty at over current condition d s 30 % notes 1. out current and diag current are not included. 2. ( ) is a reference value. measurement condition output voltage input voltage diag output voltage 90% 90% 10% 50% 10% t d(on) t on 90% t dpd t d ( off ) t off 50% truth table parameter v in v out v diag h h h normal operation l l l h l l over temperature detection l l l h chopping l over current detection l l l h h h open load detection l h h
data sheet s19284ej1v0ds 5 pd166005 outline of functions pre-driver (charge pump circuit) on/off control when the input voltage of the input pin (in) is high level (3.0 v or more), the output mos (nch) turns on. when the output voltage of the input pin (in) is low le vel (1.0 v or less), the output mos (nch) turns off. charge pump circuit is built-in to drive the output mos (nch) that is connected to the high side. over current detection circuit this circuit detects over current to output pin (out) ca used by short circuit etc., and feeds back detection signal to control circuit. when the over current is detected, the current limitation circ uit and the control circuit start operation. the output curren t is restricted and chopping operation begins. th e diag output is low level at this time. over temperature detection circuit this circuit detects over temperature by output mos (nch) driving, and feeds back detecti on signal to control circuit. when the circuit detects over temperature, the protection function of the control ci rcuit operates and output is shutdown. output mos (nch) automatically restarts when channel temperature cools down after shutdown. open load detection circuit this circuit detects connection/open load of output pin (out) when off (v in = v il ). when using the open load detection function, pull-up the output pin (out) to v cc . (recommended value: 5.1 k ? 10%) open load is detected by inputting low level input voltage (1.0 v or less) to input pin (in). da ig pin outputs hi-z (pull-up: high level) when the output pin is open. remark the pull-up resistance does not affect othe r circuits and electronic characteristics. diagnostic output circuit this circuit controls output of diagnos is signal form diag pin when over current or over temperature or open load is detected. 5 v gnd ?l? ?l? ?h? v in v out vcc v diag 5 v (pull-up) gnd off off on on on on off off open load condition off 5 v gnd ?l? ?l? ?h? v in v out t ch t hih vcc t hil
data sheet s19284ej1v0ds 6 pd166005 timing chart example of application circuit cautions 1. diag pin is nch open drain structure. wh en using diagnostic function, pull-up diag pin to 5 v. (power supply lines such as microcomputer) 2. when using open load detect ion function, pull-up out pin to v cc . (recommended value: 5.1 k ? 10%) (the pull-up resistance does not affect other circuits and electronic characteristics.) 3. if output load voltage exceeds v cc ? 50 v when l load is driven, it is necessary to protect this product with an external rectifying diode or zener diode. 4. this circuit diagram is shown as an example of connection, and is not intended for mass production design. micro. input port 5 v pd166005 gnd in vcc diag out 5.1 k output port r r v bat r load gnd 1) 2) 3) v in v out v diag normal operation over temperature detection normal operation over current detection normal operation over temperature release over current detection over current release over temperature detection
data sheet s19284ej1v0ds 7 pd166005 typical characteristics input voltage vs. power supply voltage input voltage vs. ambient temperature v ih /v il - input voltage - v 0 0.5 1 1.5 2 2.5 3 0 5 10 15 20 v ih v il v cc - power supply voltage - v v ih /v il - input voltage - v 0 0.5 1 1.5 2 2.5 3 -50 0 50 100 150 200 v ih v il t a - ambient temperature - c high level input current vs. ambient temperature low level input current vs. ambient temperature i ih - high level input current - a 0 100 200 300 400 -50 0 50 100 150 200 t a - ambient temperature - c i il - low level input current - a -10 -6 -2 2 6 10 -50 0 50 100 150 200 t a - ambient temperature - c stundby current vs. ambient temperature output leakage current vs. ambient temperature i cch /i ccl - standby current - ma 0 0.2 0.4 0.6 0.8 1 -50 0 50 100 150 200 i cch i ccl t a - ambient temperature - c i oh - output leakage current - a 0 40 80 120 160 200 -50 0 50 100 150 200 i oh2 i oh1 t a - ambient temperature - c
data sheet s19284ej1v0ds 8 pd166005 output leakage current vs. ambient temperature i ol - output leakage current - a -100 -80 -60 -40 -20 0 -50 0 50 100 150 200 t a - ambient temperature - c diag output low level voltage vs. power supply voltage diag output low level voltage vs. ambient temperature v diag - diag output low level voltage - v 0 0.1 0.2 0.3 0.4 0.5 0 5 10 15 20 v cc - power supply voltage - v v diag - diag output low level voltage - v 0 0.1 0.2 0.3 0.4 0.5 -50 0 50 100 150 200 t a - ambient temperature - c open load/load connection detection voltage vs. power supply voltage open load / load connection detection voltage vs. ambient temperature v oih /v oil - open load/load connection detection volta g e - v 0 0.5 1 1.5 2 2.5 3 3.5 4 0 5 10 15 20 v oih v oil v cc - power supply voltage - v v oih /v oil - open load/load connection detection volta g e - v 0 0.5 1 1.5 2 2.5 3 3.5 4 -50 0 50 100 150 200 v oih v oil t a - ambient temperature - c
data sheet s19284ej1v0ds 9 pd166005 drain to source on-state resistance vs. power supply voltage drain to source on-state resistance vs. ambient temperature r ds(on) - drain to source on-state resistance - m 0 40 80 120 160 200 0 5 10 15 20 v cc - power supply voltage - v r ds(on) - drain to source on-state resistance - m 0 40 80 120 160 200 -50 0 50 100 150 200 t a - ambient temperature - c over current detection vs. power supply voltage over current detection vs. ambient temperature i s - over current detection - a 0 2 4 6 8 0 5 10 15 20 v cc - power supply voltage - v i s - over current detection - a 0 2 4 6 8 -50 0 50 100 150 200 t a - ambient temperature - c output oscillation cycle at over current condition vs. power supply voltage output oscillation cycle at over current condition vs. ambient temperature t s - output oscillation cycle at over current condition - ms 0 1 2 3 4 5 6 7 0 5 10 15 20 v cc - power supply voltage - v t s - output oscillation cycle at over c urrent condition - ms 0 1 2 3 4 5 6 7 -50 0 50 100 150 200 t a - ambient temperature - c
data sheet s19284ej1v0ds 10 pd166005 output on duty at over current condition vs. power supply voltage output on duty at over current condition vs. ambient temperature d s - output on duty at over current detection - % 0 2 4 6 8 10 12 14 16 0 5 10 15 20 v cc - power supply voltage - v d s - output on duty at over current detection - % 0 2 4 6 8 10 12 14 16 -50 0 50 100 150 200 t a - ambient temperature - c turn on delay time vs. ambient temperature turn off delay time vs. ambient temperature t d(on) - turn on delay time - s 0 4 8 12 16 20 -50 0 50 100 150 200 t a - ambient temperature - c t d(off) - turn off delay time - s 0 20 40 60 80 100 120 140 160 -50 0 50 100 150 200 t a - ambient temperature - c rise time vs. ambient temperature fall time vs. ambient temperature t on - rise time - s 0 20 40 60 80 100 -50 0 50 100 150 200 t a - ambient temperature - c t off - fall time - s 0 20 40 60 80 100 -50 0 50 100 150 200 t a - ambient temperature - c
data sheet s19284ej1v0ds 11 pd166005 diag output delay time vs. ambient temperature negative output voltage vs. ambient temperature t dpd - diag output delay time - s 0 20 40 60 80 100 120 140 160 -50 0 50 100 150 200 t a - ambient temperature - c ? v o - negative output voltage - v -80 -70 -60 -50 -40 -30 -20 -10 0 -50 0 50 100 150 200 t a - ambient temperature - c transient thermal resistance characteristics transient thermal resistance vs. pulse width r th(ch-a) - transient thermal resistance - c/w 0.1 1 10 100 1000 when mounted on a glass substrate epoxy (where fr-4 is 10 cm x 10 cm, dimension of copper foil is 15% and thickness of copper foil is 35 m) r th(ch-a) = 125 c/w i r th(ch-c) = 30 c/w i pw - pulse width - s 1 m 10 m 100 m 1 10 100 1000
data sheet s19284ej1v0ds 12 pd166005 package drawing 1.27 0.12 m 6.0 0.3 4.4 0.40 +0.10 ?0.05 0.78 max. 0.05 min. 1.8 max. 1.44 0.8 0.5 0.2 0.15 +0.10 ?0.05 5.37 max. 0.10 14 85 tape information there are two types (-e1, -e2) of taping depending on the direction of the device. ? e2 type ? e1 type reel side draw-out side marking information this figure indicates the marking items and arrangement. howe ver, details of the letterform, the size and the position aren't indicated. 6005 lot code internal administrative code 1 pin mark pb-free plating marking
data sheet s19284ej1v0ds 13 pd166005 recommended soldering conditions the pd166005 should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact an nec electronics sales representative. for technical information, see the following website. semiconductor device mount manual (http://www.necel.com/pkg/en/mount/index.html) ? pd166005gr-e1-az note : power sop 8 ? pd166005gr-e2-az note : power sop 8 process conditions symbol infrared reflow maximum temperature (package?s surface temperature): 260 c or below, time at maximum temperature: 10 seconds or less, time at temperature higher than 220 c: 60 seconds or less, preheating time at 160 c to 180 c: 60 to 120 seconds, times: three times, flux: rosin flux with low chlorine (0.2 wt% or below) recommended. ir60-00-3 partial heating method pin temperature: 300c or below, heat time: 3 seconds or less (per each side of the device), flux: rosin flux with low chlorine (0.2 wt% or below) recommended. ? note pb-free (this product does not cont ain pb in the external electrode.)
data sheet s19284ej1v0ds 14 pd166005 1 2 3 4 voltage application waveform at input pin waveform distortion due to input noise or a reflected wave may cause malfunction. if the input of the cmos device stays in the area between v il (max) and v ih (min) due to noise, etc., the device may malfunction. take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between v il (max) and v ih (min). handling of unused input pins unconnected cmos device inputs can be cause of malfunction. if an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using pull-up or pull-down circuitry. each unused pin should be connected to v dd or gnd via a resistor if there is a possibility that it will be an output pin. all handling related to unused pins must be judged separately for each device and according to related specifications governing the device. precaution against esd a strong electric field, when exposed to a mos device, can cause destruction of the gate oxide and ultimately degrade the device operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. environmental control must be adequate. when it is dry, a humidifier should be used. it is recommended to avoid using insulators that easily build up static electricity. semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work benches and floors should be grounded. the operator should be grounded using a wrist strap. semiconductor devices must not be touched with bare hands. similar precautions need to be taken for pw boards with mounted semiconductor devices. status before initialization power-on does not necessarily define the initial status of a mos device. immediately after the power source is turned on, devices with reset functions have not yet been initialized. hence, power-on does not guarantee output pin levels, i/o settings or contents of registers. a device is not initialized until the reset signal is received. a reset operation must be executed immediately after power-on for devices with reset functions. power on/off sequence in the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. when switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. the correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. input of signal during power off state do not input signals or an i/o pull-up power supply while the device is not powered. the current injection that results from input of such a signal or i/o pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. input of signals during the power off state must be judged separately for each device and according to related specifications governing the device. notes for cmos devices 5 6
pd166005 the information in this document is current as of july, 2008. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec e lectronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e 02. 11-1 (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "standard": "special": "specific":

▲Up To Search▲

Price & Availability of UPD166005GR-E2-AZ

	To Download UPD166005GR-E2-AZ Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .